Optimize the Electronics Lifecycle with TestEquity
The electronics industry is plagued by growing complexity, an ever-changing technological landscape, supply chain volatility, and rising sustainability demands that challenge manufacturers throughout the product lifecycle. From research and design to production, assembly, and long-term maintenance, companies must adapt dynamically to remain competitive. Successfully navigating these challenges requires access to innovative test equipment, precision materials, and agile procurement solutions.
TestEquity and its affiliated companies, like Hisco, provide engineers and manufacturers with the tools, materials, and lifecycle management strategies required to optimize electronic design, production, and maintenance processes.
Balance Design Trade-Offs with Smarter Tools and Materials
As consumer demands rise and devices become more sophisticated, design engineers must navigate increasingly difficult trade-offs. For example, emerging high-frequency 5G/6G applications are demanding circuits that are smaller, thermally optimized, and heavily shielded for RF. From a test perspective, balancing such trade-offs requires state-of-the-art tools and innovative materials.
Bridge the Gap Between Digital Design and Real-World Performance
Today, designers are turning to AI-driven PCB design tools to optimize signal integrity, power distribution, and EMI mitigation before physical prototyping begins. These solutions help designers identify failure points, optimize layouts, and reduce the need for expensive board revisions. Though these tools help to identify failure points and optimize layouts, engineers still need to validate their designs with physical prototypes to ensure real-world performance.
Meanwhile, additive manufacturing techniques, such as conductive ink and multi-material 3D printing, are streamlining this phase by allowing engineers to produce functional circuit boards without the delays of traditional PCB fabrication. However, even with faster prototyping, ensuring thermal efficiency and EMI shielding remains difficult.
TestEquity supports these innovations by giving engineers flexible access to high-bandwidth oscilloscopes, spectrum analyzers, and power measurement tools to validate next-generation designs before full-scale production. In addition, in partnership with Hisco, TestEquity offers custom die-cut thermal and EMI shielding materials to improve pre-production precision and efficiency.

A Keysight digital oscilloscope is available from TestEquity. (Source: TestEquity)
Scale Production Without Sacrificing Quality
Scaling production efficiently while maintaining high product quality poses a major challenge for manufacturers. For instance, semiconductor nodes below 5 nm increase the risk of electrostatic discharge (ESD) failures and, therefore, require strict compliance with ANSI/ESD S20.20 standards. Even with automation, manufacturers struggle to balance speed and quality while preserving supply chain stability.
Leverage Smart Manufacturing to Reduce Defects and Waste
To reduce defect rates and manual rework, machine learning-powered inspection systems now analyze solder joints, PCB traces, and component placement in real-time. These systems detect micro-defects invisible to human inspectors and improve yields. Moreover, RFID-based tracking and IoT-enabled supply chains enhance real-time visibility into component stock levels to help prevent shortages that could disrupt production schedules.

TestEquity’s lineup of Techni-Pro ESD solutions. (Source: TestEquity)
Hisco’s RFID-enabled inventory tracking system, powered by Xemelgo, optimizes material flow and prevents bottlenecks. Designed to integrate with any ERP, our software analyzes data, provides feedback, and helps you make decisions that reduce risk, minimize loss, and improve efficiency through work-in-progress, asset tracking, and Vendor Managed Inventory (VMI). Manufacturers also benefit from Techni-Pro, TestEquity’s private-label line of cost-effective, high-quality ESD-safe tools, soldering solutions, and cleanroom supplies to maintain efficiency while controlling costs.
Further, TestEquity provides custom RF shielding, thermal interface materials, and ESD-safe solutions that allow engineers to solve complex assembly challenges without incurring costly late-stage revisions.
Anticipate and Prevent Supply Chain Disruptions
Component shortages continue to impact electronics manufacturing, forcing companies to rethink procurement strategies. Traditional sourcing methods often lead to last-minute redesigns because of unavailable components, increasing costs, and time-to-market delays.
TestEquity’s Punchout platform provides real-time component availability data that allows companies to anticipate shortages before they disrupt production. By integrating predictive analytics with eProcurement, manufacturers can identify at-risk components early and secure alternatives before supply issues arise. In addition, TestEquity’s VMI programs guarantee continuous material availability without incurring excess stock costs.
Fear of Failure? Avoid Frustrations with Predictive Maintenance
Long-term reliability is necessary in long-life applications, such as telecommunications, industrial automation, aerospace, and consumer electronics. Traditional reactive maintenance models, which address failures only after they have occurred, lead to unwanted downtime and emergency interventions. To solve that problem, engineers have shifted toward predictive maintenance, powered by IoT sensors and AI-driven diagnostics.
Enhancing Failure-Prediction Accuracy
Edge AI models can analyze sensor data in real-time to detect anomalies such as unusual vibration patterns, thermal fluctuations, and impedance shifts. Such insights allow engineers to schedule maintenance proactively, reduce equipment failure rates, and optimize operational uptime.

TestEquity Tool Control solutions. (Source: TestEquity)
At the same time, the expansion of high-frequency communications has increased the need for field-portable spectrum analyzers capable of identifying RF interference and troubleshooting signal integrity issues in real-world environments.